Automatic Lamp Die Bonder
Dual-Dispensing Die Bonder
MOQ ： piece
Lead Time ： Days
Seller Support : Trade Authenticity Guaranteed & Accepting
Payment : L/C，T/T，Western Union, Money Gram, Credit Card, Paypal
Product details
Supply Ability
- Supply Ability： piecesWarranty(Year)：1 Year
Packaging & Delivery
- Packaging： piece
Product Specifications
Product Description
June Chip 300D
Dual- Dispensing Die Bonder
·Application: All kinds of RGB LED
Dual Epoxy heads and Plates Applies for the 2 different glue Die Bonding
·Average Cycle Time: 280ms / cycle
·UPH：12K
·Wafer X/Y ：6"×6"
·Workholder X/Y ：10"×6"
·Die Placement Accuracy：±0.5mil
·Die Size：5mil-40mil
·Wafer Diameter: 6"
·Maximum 4 wafers working at the same time
·Flexible and Changeable Collet Head
·Automatic Inspection System, Automatic Level Detection
·Intelligent PR System (iPR)
·LCD touch screen
·Bilingual Menu
·Power 2000W
·Dimension 1200 x 900x 1500mm
·Weight 450kgs
Dual- Dispensing Die Bonder
·Application: All kinds of RGB LED
Dual Epoxy heads and Plates Applies for the 2 different glue Die Bonding
·Average Cycle Time: 280ms / cycle
·UPH：12K
·Wafer X/Y ：6"×6"
·Workholder X/Y ：10"×6"
·Die Placement Accuracy：±0.5mil
·Die Size：5mil-40mil
·Wafer Diameter: 6"
·Maximum 4 wafers working at the same time
·Flexible and Changeable Collet Head
·Automatic Inspection System, Automatic Level Detection
·Intelligent PR System (iPR)
·LCD touch screen
·Bilingual Menu
·Power 2000W
·Dimension 1200 x 900x 1500mm
·Weight 450kgs
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Year Established: 24YRS
